NDS 3DS Teardown

D volume" slide button to its uppermost position, positioning the screen in front of the eyes, making sure that the distance between the eyes and the screen is 25-35cm, etc. The button is located on the right side of the chassis. The user can view optimal 3D images by using the 3D volume button to adjust 3D effects.

While checking 3D images viewable with the naked eye, we felt that they were more beautiful than we expected. The upper LCD panel, which supports 3D display, is 3.53 inches in size, and its pixel count is 800 (horizontal direction) x 240 (vertical direction).

For 3D display, half of the horizontal 800 pixels are allotted to each of the right and left eyes, but the resolution is still as high as 132ppi (the resolution was calculated by the teardown squad). This might be high enough for a portable game console.

Well, it would be disappointing if we finished the evaluation of the 3D display here. So, we moved on and examined the pixels by using a 100x zoom loupe.

The 3D display of the 3DS seems to be realized by using a "parallax barrier," which partially blocks light, to show different images to the right and left eyes. However, Nintendo has not disclosed the technologies used for the 3D display. Our assumption has been based on the display properties and the fact that Sharp Corp, which is considered to be one of the suppliers of the 3DS' panel, developed technologies similar to the ones used for the 3DS (See related article 1, 2).

In fact, when we looked into the upper LCD panel with the loupe, we found an LCD panel that seemed to have a function of switching on and off the parallax barrier (in addition to another LCD panel used for displaying images). When the 3D volume was turned off, the parallax barrier was turned off, too.

As for the pixels of the LCD panel for displaying images, we found that its red, green and blue sub-pixels were horizontally arranged. We felt like examining the structure that uses the two LCD panels.

By repressing that feeling, we continued to configure settings. After going through "time and date," "user information," "Internet settings," "parental restrictions" and so forth, the menu screen finally appeared.

The first item listed on the menu screen was about the safe use of the 3DS. When this item was selected, cautionary statements about 3D images, health risks and the use of the 3DS appeared. Because some people are pointing out the negative impact of 3D images on small children, it seems that Nintendo made every effort to promote awareness.

Anyway, we finished configuring settings. We would have just played games with the 3DS if we had time. But we started to disassemble it immediately.

After checking the 3D display of the Nintendo 3DS, we started to tear down its main body by disassembling the lower chassis, in which we thought the main board was located.

This is normally the most difficult task when we break down an electronic device. Especially, we had trouble in disassembling Apple Inc's iPhone and iPad because their upper and lower chassis are fitted into each other without using screws.

However, we did not have such a problem with the 3DS. There were four screws on the lower chassis, and they could be removed by using a cross head screwdriver. We thought that the teardown of the 3DS would go smoothly.

After removing the four screws, a lithium-ion (Li-ion) rechargeable battery appeared. Its capacity was 1,300mAh. According to Nintendo, the 3DS can be continuously used for three to five hours when a game for the 3DS is being played and five to eight hours when a game for the Nintendo DS is being played.

It takes about three and a half hours to charge the battery. We wondered if the screws are supposed to be removed by the user or a shop clerk for replacing the battery.

In any case, we moved on because there were many things left to be torn down. And we succeeded in breaking down the lower chassis without any major trouble.

Then, we examined the main board. It looked tidy probably because the 3DS is a machine dedicated to gaming.

On the main board, the character "MITSUMI," which was seen under the slot for game cartridges, drew our attention. From the model number, "DWM-W028," we estimated it to be Mitsumi Electric Co Ltd's wireless LAN module supporting IEEE802.11b/g.

The slot for SD memory cards was also printed with the character "MITSUMI," suggesting the possibility that Mitsumi Electric is supplying many electronic components for the 3DS as it does for Nintendo's previous portable game consoles.

At this point, we could not find the main CPU. We began to remove the main board from the chassis to carefully examine it.

Nikkei Electronics Teardown Squad successfully tore down the lower chassis of the Nintendo 3DS and took out the main board from the chassis to carefully examine it.

We looked at the entire main board after removing the wireless LAN module printed with the "MITSUMI" mark, the slot for SD memory cards and so forth. On the back of the board, a chip printed with the characters "TOSHIBA" and "THGBM2G3PIFBAI8" ("I" is possibly "1") drew our attention. Judging from the model number, it seemed to be NAND flash memory. And, probably, it stores a system.

On the other hand, there were only few components embedded on the top side of the main board such as Texas Instruments Inc's "PAIC30108" and its peripheral circuits. Considering that there is a connection port for the lithium-ion (Li-ion) rechargeable battery on the back of the PAIC30108, it is probably a power supply chip.

After briefly examining the top and back sides of the main board, we realized an important thing: We could not find the main CPU. There was only one possibility left: under the slot for game cartridges. There were many passive components embedded on the back of the slot.

We managed to remove the slot, which was firmly fixed on the board, by using a soldering iron, etc. Then, the main CPU of the 3DS printed with the characters "Nintendo" and "ARM" appeared. A chip found next to the CPU was printed with "F JAPAN" and "M82M808080." It seemed to be Fujitsu Semiconductor Ltd's FCRAM.

We were relieved by finding the main CPU and began to disassemble the upper chassis, which contained the 3D LCD panel module viewable with the naked eye and was the main target of the teardown. By the way, we will tear down the touch-sensitive LCD panel module located in the lower chassis later, together with the 3D LCD panel module.

After examining the main board of the Nintendo 3DS, Nikkei Electronics Teardown Squad started to tear down the upper chassis, which houses the 3D LCD panel viewable with the naked eye.

While looking over the upper chassis, we could not find any screws. Also, there did not seem to be any screws under the resin cover. So, we concluded that the cover was attached to the chassis with a double-sided tape.

We began to separate the tape by using a flat-blade screwdriver while taking care not to damage the chassis and the components inside it. The tape was stickier than we thought and more like a tape used for water-proof mobile phones (See related article). So, we ended up removing it by sheer force.

Then, we took out the 3D LCD panel module, which was analyzed later together with the touch-sensitive LCD panel module stored in the lower chassis. And we started to examine the camera module of the 3DS.

The 3DS has an improved camera function compared with the Nintendo DSi. It has two cameras on the outer side of the chassis so that 3D pictures can be taken in addition to a camera embedded in the inner side of the chassis. The pixel count of each camera is about 300,000 (640 x 480).

The camera module of the 3DS consists of three CMOS camera modules, each of which has a pixel count of 300,000. Electrically-conductive coating was applied to the flexible substrate probably for reducing noise. This structure is not much different from that of the DSi, which has a camera module consisting of two CMOS camera modules (See related article 2).

The camera module turned out to be simpler than we expected. Finally, we started to disassemble the two LCD panels stored in the upper and lower chassis.

Via:http://techon.nikkeibp.co.jp/english/NEWS_EN/20110228/189942/